近年来，随着5G、AI、物联网、大数据等技术不断突破创新，行业对体积更轻薄、数据传输速率更快、功率损耗更小、成本更低的芯片需求大幅提高。但当先进制程进入5nm时代后，制程提升速度大大放缓，摩尔定律似乎已经达到极限。在这个大背景下，先进封装技术逐渐成为业内关注和讨论的热点……
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